About Us:
At InspireSemi, we’re not just building chips; we’re revolutionizing high-performance computing. Our groundbreaking architecture packs thousands of 64-bit CPU cores onto a single chip, all seamlessly connected. We’re driven by a mission to make high performance computing more accessible, energy-efficient, and easier for developers to harness. Ready to make a real impact? Join our passionate team!
Why Join InspireSemi?
- Be a Pioneer: Get in on the ground floor of a hypergrowth startup! You’ll be part of a small, dynamic team shaping the future of computing.
- Make an Impact: Your work will directly contribute to disruptive technology.
- Grow With Us: Seize significant growth and development opportunities, including the chance to build and lead a team.
- Rewarding Compensation: We offer a competitive salary, bonus potential, and meaningful equity.
- Flexibility: Benefit from a hybrid work model (with potential for fully remote for exceptional candidates) and flexible time off.
The Opportunity:
We’re seeking a skilled Hardware Engineer to support the development of cutting-edge PCB and packaging solutions. You’ll dive deep into advanced technologies like HDI, SiP, and Direct Die Attachment. Working closely with talented colleagues and suppliers, you will design, simulate, and produce the high-speed, high-power PCBs that form the backbone of our revolutionary accelerators.
What You’ll Do:
- Create schematics and critical layout for advanced PCB designs.
- Develop and document design and layout guidelines for our systems.
- Model and simulate high-frequency characteristics for packages and PCBs.
- Lead system bring-up and validation efforts in the lab.
- Debug, meticulously document, and track hardware issues.
- Collaborate with partners and vendors to define requirements and create models.
- Some travel may be required
What You Bring:
- A BS or MS in Electrical or Computer Engineering.
- 3+ years of relevant hands-on experience.
- Proven experience with high-speed digital signaling (e.g., PCIe, DDR/LPDDR).
- Strong background in silicon packaging and PCB design focused on signal integrity.
- Proficiency with EDA tools (like Cadence or Altium).
- Experience using FEM and SPICE for modeling and simulation.
- Scripting and programming skills (e.g., Python, TCL, or C/C++).
- Ability to skillfully use lab equipment (scopes, analyzers) for complex debugging.
- A knack for working independently while also being a strong team collaborator.
Bonus Points:
- Experience with Power Delivery Systems (PDN).
- Background in analog and digital circuit design.
- Deep understanding of electromagnetic theory and circuit analysis.
If you’re excited about pushing the boundaries of computing and working on truly innovative technology in a rewarding environment, we’d love to hear from you!