In this position, the successful candidate will support the development of PCB and packaging that take advantage of advanced technologies such as HDI, SiP, Direct Die Attachment.  You will work closely with your InspireSemi coworkers and suppliers to design, simulate, and produce PCBs with high-speed signaling and advanced power delivery.   

Job Responsibilities 

  • Creating schematics and critical layout for design of PCBs  
  • Creating design and layout guidelines for our system 
  • Modeling and simulating high frequency characteristics for packages and PCBs 
  • Bring-up and validating systems in the laboratory  
  • Debug, document, and track issues 
  • Work with partners and vendors to define requirements and create models 
  • Work in collaborative, multi-disciplinary team 
  • Some travel may be required 

Qualifications 

  • 3+ years of relevant experience 
  • Experience in analog and digital circuit design 
  • Experience in electromagnetic theory and circuit analysis 
  • Experience in silicon packaging and PCB design for signal integrity 
  • Experience with EDA tools, such as Cadence or Altium 
  • Experience in FEM and SPICE modeling and simulation 
  • Experience with scripting and programming e.g., Python, TCL, or C/C++ 
  • Ability to use lab equipment, scopes and analyzers, to debug complex problems 
  • Ability to both work independently and collaborate harmoniously 

Highly Preferred Qualifications 

  • Experience with high-speed digital signaling interfaces such as PCIe and DDR 

Education & Experience 

  • BS or MS Electrical or Computer Engineering 

Additional Requirements 

  • Excellent written and verbal communication skills 
  • Highly organized and detail oriented 
Job Category: engineering
Job Type: Full Time
Job Location: Austin

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